If you've been following chipmaker Intel (NASDAQ: INTC) lately, you probably know that during the current fourth quarter, the company expects to run into supply constraints in its chip production due to demand which has blown past its original expectations. Indeed, the company had originally planned for revenue of $65 billion for 2018 and that figure is now set to come in at $71.2 billion. On Dec. 17, Intel announced that it will "take the necessary steps to prepare our global manufacturing network for flexibility and responsiveness to changes in demand." Continue Reading Below Let's take a closer look at what the company had to say and what that ultimately means for investors. Expansions, ahoy!In the announcement, via an editorial post on Intel's website by Manufacturing and Operations General Manager Ann Kelleher, the company reminded investors that it had boosted its capital expenditure budget for the year "and put that money to work expanding our 14nm (nanometer) manufacturing capacity to increase supply." The tech titan's latest Core, Xeon, and Atom processors are all manufactured using derivatives of Intel's 14nm technology. The company also observed that it's made "good progress on the previously announced schedule for the Fab 42 fit-out in Arizona, and [we have] made the decision to locate development of a new generation of storage and memory technology at our manufacturing plant in New Mexico." Advertisement As you might recall, Intel had announced that it was building a new manufacturing plant called Fab 42 many years ago but decided in 2014 to not to equip it. Here's Kelleher's explanation for why Intel didn't complete Fab 42 at the time: "It is a factory that we originally started building in 2011, aiming for our 14-nanometer technology. Then, based on a number of manufacturing efficiencies, we were able to defer using Fab 42 because we were able to fit the 14nm capacity into our existing factory on the Arizona site." However, in early 2017, the company announced that the Fab 42 project would finally be completed and that it would eventually produce chips manufactured on the company's 7-nanometer technology (Intel has yet to bring its 10-nanometer technology into mass production.). Beyond that, the Kelleher stated the following: "Looking ahead, we are now in the early planning phase for manufacturing site expansions in Oregon, Ireland, and Israel, with multi-year construction activities expected to begin in 2019." Kelleher went on to explain that "[having] additional fab space at-the-ready will help us respond more quickly to upticks in the market and enables us to reduce our time to increased supply by up to roughly 60 percent." Investor takeawayIt's easy to see why this announcement is a positive for Intel's business. The company ultimately lost out on revenue this year that it could have otherwise enjoyed had it been able to more rapidly bring additional 14-nanometer capacity online to meet demand. Not only that, leaving any customers out in the cold and causing them to miss out on potential revenue isn't a comfortable spot for Intel to be in. CFO and interim CEO Bob Swan said on the company's last earnings call that "the lower end of PC and the [Internet of Things] business is being [supply] constrained." That hasn't been conducive to maintaining healthy business relationships. Intel and its shareholders should hope that the announced actions to increase responsiveness to shifts in demand will prove as effective as the company is indicating they'll be. 10 stocks we like better than IntelWhen investing geniuses David and Tom Gardner have a stock tip, it can pay to listen. After all, the newsletter they have run for over a decade, Motley Fool Stock Advisor, has quadrupled the market.* David and Tom just revealed what they believe are the 10 best stocks for investors to buy right now... and Intel wasn't one of them! That's right -- they think these 10 stocks are even better buys. Click here to learn about these picks! *Stock Advisor returns as of November 14, 2018 Ashraf Eassa has no position in any of the stocks mentioned. The Motley Fool has no position in any of the stocks mentioned. The Motley Fool has a disclosure policy. Read More Intel Announces Chip Manufacturing Expansion - Fox Business : https://ift.tt/2BwOTaO
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In context: After an extremely difficult 2018 that featured both, ongoing delays in producing new 10 nm chips and the unceremonious exit of its CEO, Intel is also facing the toughest competitive environment it’s seen in some time. Not only is a resurgent AMD becoming a serious threat in both the PC and server markets, but Nvidia has managed to snag most of the focus in the attention-grabbing AI market, and new offerings from Qualcomm show that its computing capabilities are much stronger than many may have realized.Competition really is a great thing, and if you ever really needed a reminder of how and why, look no further than the recently rejuvenated, albeit humbled, semiconductor behemoth based in Santa Clara, CA. As a result of all these challenges, Intel has been forced to rethink a number of its previous investments, reorganize its increasingly scattered divisions, and put together a strategy that could both directly address the new competitive environment and leverage many of the unique capabilities that make Intel what it still is today (lest we forget): the largest semiconductor company in the world. Thankfully, the company recently laid out its new vision through a series of announcements about new technology directions and strategy delivered at an industry analyst summit and tech press event. Specifically, on the technology side, the company discussed a new variation on the “chiplet” concept that leverages a new 3D chip-stacking technology codenamed Foveros. Instead of trying to continue along the traditional Moore’s Law path of increasing transistor density horizontally via large and complicated monolithic chips created on a single process technology node, Foveros technology represents an important pivot towards vertical density. Practically speaking, what this means is that the company can combine several different chips created at different process sizes, while still increasing overall transistor density, in a single chip package. It’s a fascinating development that highlights how Intel is still able to maintain its long history of manufacturing advances, despite the challenges it faced in bringing 10 nm chips to market. The first real-world example of Foveros’ ability to integrate heterogenous pieces together is the newly announced Sunny Cove architecture, expected to ship in 2019, which will combine both 10 nm Core “big” CPUs with several “little” Atom CPUs, into a new hybrid x86 architecture (which, yes, sounds conceptually very similar to the “big.Little” architecture designs that Arm and its customers have been talking about for years). The idea is to enable much more power-friendly x86 designs—it will be interesting to see what kinds of devices this new platform will enable. The first real-world example of Foveros’ ability to integrate heterogenous pieces together is the newly announced Sunny Cove architecture, expected to ship in 2019, which will combine both 10 nm Core “big” CPUs with several “little” Atom CPUs, into a new hybrid x86 architecture At the strategic level, the company highlighted a new approach built on six pillars—Process, Architecture, Memory, Interconnect, Security and Software—that manages to tie together a number of different resources that Intel owns into a nicely unified, and powerful, vision of the future of computing. The process advances are built not just on Foveros, but the simultaneous work its been doing for both 7nm and 5nm, both of which are expected to benefit from the hard-won lessons the company learned on 10nm. Throw in the announcements about plans for new fabs and it’s clear the company is focused on moving forward aggressively on the process front. Architecturally, the company discussed both the wide range of different architectures it’s creating, including CPU (scalar), GPU (vector), AI (matrix) and FPGA (spatial), compute offerings, as well as advancements in each of those areas. Over the years, Intel has amassed an impressive collection of different companies and architectures, but this was the first time it provided a unified vision that tied all the pieces together. The event also saw the first release of a few more details on their upcoming dedicated GPU effort, currently codenamed Xe and scheduled for release in 2020. On the memory side, the company highlighted its advances in Optane storage and memory products. Intel emphasized new types of memory that break down the barriers between traditional DRAM and storage, and enable the creation of more sophisticated and much faster overall computing system designs. These memory capabilities are a unique and often overlooked advantage Intel offers versus most all of its competition. Given the exploding amounts of data being created and processed, these memory technologies will be critically important for the increasingly large data sets that data center-based components are going to need to have. (The fact that a simpler form of 3D stacking process technology is also used to build many Optane parts certainly doesn’t hurt either.) The ruler-shaped PCIe-based QLC Intel SSD D5-P4326 can hold up to 32 terabytes. The need to provide better and faster connections between various elements is another key capability in building more sophisticated chip and system designs in an increasingly heterogenous computing world. True to form, Intel talked about a wide range of options it offers in this area as well. From 5G modems to silicon photonics to new ultra-high-speed serial connections between chiplet components in stacked 3D designs, Intel has a number of interconnect technologies that it can leverage in future components and devices. Security, of course, is a key factor for any company today, and, though Intel has faced some big concerns around Spectre, Meltdown, and other related chip architecture flaws, the company recognizes the need to incorporate security capabilities into all of its offerings. In particular, Intel is investing to integrate a multi-prong security story that reaches across the chip level, SOC level, board level, and software level to ensure the safest possible devices. Finally, one of the most audacious new goals for Intel is a new software strategy built around what they’re temporarily calling One API. The basic concept is to create a layer of software abstraction that would allow programmers to write at this higher level, then smartly take advantage of whatever hardware system capabilities are available in a given system, from hybrid chip architectures to unique memory offerings and more. In theory, this includes the ability to send certain bits of code to one chip type and other chunks to other types while still maintaining most of the raw performance that would be available if programmers wrote straight to the metal. It’s a goal that many people have talked about—and it still remains to be seen if Intel can execute on it—but it would certainly provide a key advantage to Intel in an increasingly heterogeneous computing world. In addition to these important technology and strategy announcements, it was clear that there was a new attitude within Intel’s executive ranks. In addition to a humbler approach, the company openly talked about being a smaller player in a bigger market. Clearly, the goal was to re-emphasize the fact that the company is now seeing themselves being able to participate in a broader range of opportunities than it traditionally has. There was even a joking reference about bringing back former CEO Andy Grove’s desire for Intel to always be paranoid about the competition—a quality that, frankly, seemed to fade over the last few years. At roughly 107,000 employees, Intel is a very large organization, and it can often be tough to turn big ships around. It’s clear, however, that there’s a fresh attitude and approach there that certainly makes them appear to be much better prepared for an increasingly diverse computing future. Now, if they could only fill that CEO job…. Bob O’Donnell is the founder and chief analyst of TECHnalysis Research, LLC a technology consulting and market research firm. You can follow him on Twitter @bobodtech. This article was originally published on Tech.pinions. Related ReadsIf you've been following chipmaker Intel (NASDAQ:INTC) lately, you probably know that during the current fourth quarter, the company expects to run into supply constraints in its chip production due to demand which has blown past its original expectations. Indeed, the company had originally planned for revenue of $65 billion for 2018 and that figure is now set to come in at $71.2 billion. On Dec. 17, Intel announced that it will "take the necessary steps to prepare our global manufacturing network for flexibility and responsiveness to changes in demand." ![]() Image source: Intel. Let's take a closer look at what the company had to say and what that ultimately means for investors. Expansions, ahoy!In the announcement, via an editorial post on Intel's website by Manufacturing and Operations General Manager Ann Kelleher, the company reminded investors that it had boosted its capital expenditure budget for the year "and put that money to work expanding our 14nm (nanometer) manufacturing capacity to increase supply." The tech titan's latest Core, Xeon, and Atom processors are all manufactured using derivatives of Intel's 14nm technology. The company also observed that it's made "good progress on the previously announced schedule for the Fab 42 fit-out in Arizona, and [we have] made the decision to locate development of a new generation of storage and memory technology at our manufacturing plant in New Mexico." As you might recall, Intel had announced that it was building a new manufacturing plant called Fab 42 many years ago but decided in 2014 to not to equip it. Here's Kelleher's explanation for why Intel didn't complete Fab 42 at the time: "It is a factory that we originally started building in 2011, aiming for our 14-nanometer technology. Then, based on a number of manufacturing efficiencies, we were able to defer using Fab 42 because we were able to fit the 14nm capacity into our existing factory on the Arizona site." However, in early 2017, the company announced that the Fab 42 project would finally be completed and that it would eventually produce chips manufactured on the company's 7-nanometer technology (Intel has yet to bring its 10-nanometer technology into mass production.). Beyond that, the Kelleher stated the following: "Looking ahead, we are now in the early planning phase for manufacturing site expansions in Oregon, Ireland, and Israel, with multi-year construction activities expected to begin in 2019." Kelleher went on to explain that "[having] additional fab space at-the-ready will help us respond more quickly to upticks in the market and enables us to reduce our time to increased supply by up to roughly 60 percent." Investor takeawayIt's easy to see why this announcement is a positive for Intel's business. The company ultimately lost out on revenue this year that it could have otherwise enjoyed had it been able to more rapidly bring additional 14-nanometer capacity online to meet demand. Not only that, leaving any customers out in the cold and causing them to miss out on potential revenue isn't a comfortable spot for Intel to be in. CFO and interim CEO Bob Swan said on the company's last earnings call that "the lower end of PC and the [Internet of Things] business is being [supply] constrained." That hasn't been conducive to maintaining healthy business relationships. Intel and its shareholders should hope that the announced actions to increase responsiveness to shifts in demand will prove as effective as the company is indicating they'll be. Ashraf Eassa has no position in any of the stocks mentioned. The Motley Fool has no position in any of the stocks mentioned. The Motley Fool has a disclosure policy. Intel seeks Oregon tax-exempt bonds to help finance $600 million water project - OregonLive.com12/18/2018 ![]() Intel wants $300 million in tax-exempt bonds from the state to help finance an enormous, $600 million water treatment project in Hillsboro. The bonds could save Intel millions of dollars and would cost Oregon little or nothing in lost tax revenue. However, the state has limited capacity for issuing this class of bond and officials may decide to reserve some of that capacity for affordable housing instead. It’s a complicated situation with potentially significant implications for both Oregon’s largest corporate employer and efforts to combat the state’s housing crisis. Intel’s water project has been under construction for well over a year. The company uses nearly 3 billion gallons of water every year in its Hillsboro factory, and the city’s water department says the project could reduce its water use by a third or more. The bonds Intel seeks would be issued under a class of borrowing known as industrial development bonds. Oregon taxpayers wouldn’t be on the hook for any of the debt, Intel would be. The bonds are tax exempt, meaning Intel would pay interest rates 20 to 25 percent lower than standard corporate bonds – potentially saving millions of dollars. The state might give up some lost tax revenue, if individual Oregon taxpayers buy the bonds, but it probably will be minimal. The bigger implication could be that it eats into Oregon’s allotment for other federally authorized private activity bonds, which might otherwise be used for other purposes. Oregon has had plenty of capacity under its threshold for private activity bonds in the past several years. That may be about to change, though: Developers also use such bonds to help finance home construction, and the state’s housing crunch could take precedence over Intel. A recent report from economic research firm ECONorthwest and a coalition called Up for Growth found Oregon produced 155,000 fewer new housing units than it needed between 2000 and 2015 to keep up with population growth. That contributed to rising rents and home prices that strained household budgets and pushed more people into homelessness. Private activity bonds, including the Metro housing bond voters in the Portland area approved last month, could help finance more construction. And that could consume some of the bonding capacity Intel is seeking. “Because of what’s happening with affordable housing we could start bumping into that limit,” said James Sinks, spokesman for the Oregon state treasury. “That’s new.” Intel declined to provide a detailed description of its water project but did acknowledge that it wants the state bonding to help finance it. “Intel has submitted an application to Business Oregon requesting private activity bonds to support our efforts to reduce our environmental impact, including facilities and systems to treat wastewater, effluent, and air emissions,” the company said. Though reducing water use could be worth millions to Intel, the savings is nowhere near the project’s $600 million price tag. That suggests there must be another reason why Intel needs an upgraded water treatment facility, such as changes in the scale or technology underlying its Oregon manufacturing operations. On Monday, Intel said it plans to expand factories in Hillsboro and at its other major production sites around the world. Industrial development bonds are a relatively obscure economic development tool. Here’s how they work:
Even if Oregon has little revenue at stake, the bonds still seem inappropriate to Jody Wiser of Tax Fairness Oregon, a watchdog organization that polices corporate tax policy. She noted the bonds still constitute a federal tax break. “Industry should be borrowing money on the market. They shouldn’t be getting tax-free bonds,” Wiser said. “It becomes a public subsidy.” Intel is Oregon’s largest corporate employer, with 20,000 people working in Washington County. Hiro Ito, chair of Portland State University’s economics department, said makes sense for Oregon to issue the Intel bonds since the cost to the state is minimal – but the $600 million project will produce a lot of work. “Yes, they lose some tax revenues, but the economic impact arising from building the water conservation project will compensate for that,” Ito wrote. “It can be even cheaper after all.” Earlier this year, Oregon issued industrial development bonds for a $245 million for a company called Red Rock Biofuels to build a renewable energy project in Lake County. Red Rock promises 30 jobs associated with its project. The state has issued just a handful of these bonds in the past five years. That’s likely because of historically low interest rates: when interest rates are low, the benefit from the discount that comes from tax-free bonds is also lower. With interest rates rising, though, more companies may follow Intel’s path. “At a time when you have low interest rates the hassle of going through this process probably not worth it,” said Mazen Malik, senior economist with the Oregon Revenue Office. “But when you have higher interest rates it becomes more rewarding to do so.” Intel applied for its Oregon bonds in September. The company has received preliminary approval from the state treasurer but still must clear a public hearing and win sign-off from the governor. State officials said it’s impossible to estimate how long that could take, but a committee with decision-making authority on private activity bonding meets next month. Gov. Kate Brown’s forthcoming budget proposes more bonding authority be reserved for housing construction and less for industrial development. But the tax-exempt bonding Intel seeks is from the current budget cycle. So the committee will have to weigh competing requests to aid housing or economic development, according to Sinks, the treasury spokesman. “At the end of the day that’s where the decisions are going to be made,” he said. “This is going to be an interesting new dynamic.” -- Mike Rogoway | twitter: @rogoway | 503-294-7699 Read More Intel seeks Oregon tax-exempt bonds to help finance $600 million water project - OregonLive.com : https://ift.tt/2A6GAm9![]() “With unit cost falling as the number of components per circuit rises, by 1975 economics may dictate squeezing as many as 65,000 components on a single silicon chip.” – Gordon E. Moore, “Cramming More Components onto Integrated Circuits,” Electronics, pp. 114–117, April 19, 1965. Our shuttle bus driver exited 101 and began to weave through an increasingly narrow labyrinth of residential streets. There were eight or nine journalists on the bus, and none of us had any idea where we were headed. Apparently, the driver didn’t either. Intel’s invitation had been obviously deliberately vague, informing us only that a shuttle bus would arrive at our hotel to transport us to “the venue” and that “the venue” was NOT on the nearby Intel campus. As the shuttle bounced down a series of skinny two lane roads, it gradually became apparent that we were lost and, after making a couple of awkward U turns, the shuttle driver pulled over and called someone on his cell phone. “Yep, I just went past there… OK, I think I see you up the hill.” We wound up a narrow nearby driveway into a small parking area and disembarked into a beautiful residential estate. It was the former home of Intel co-founder Robert Noyce. Intel had brought a small group of journalists here for an extraordinary event, modestly billed as “Architecture Day.” The intimate venue was buzzing with Intel staff zipping here and there, firing up demo stations, tweaking the presentation area, working with caterers, and coordinating photographers and videographers who had been hired to document the proceedings. Intel’s technology brain trust was in the house, milling around amongst the arriving journalists. Raja Koduri – Intel chief architect, kicked off the presentations with a broad view of Intel’s architecture strategy. Koduri came to Intel about a year ago, in November 2017, from AMD’s Radeon group, where he led AMD’s APU, discrete GPU, and semi-custom and GPU compute products. Before that, he was director of graphics architecture at Apple, where he drove the graphics subsystem for the Mac product family, leading the transition to Retina computer displays. Koduri described Intel’s strategic technology vision in terms of six pillars – process, architecture, memory, interconnect, security, and software. He then painted a picture of the global computing infrastructure domains from client devices through the edge/network layers back to the data center/cloud. He cross-divided compute architectures into scalar, vector, matrix, and spatial constructs, and he asserted that the future of computing involved a heterogeneous combination of those architectures working together across those domains, with each architecture taking on appropriate types of workloads, and with each part of the computing problem solved at the appropriate distance from the end user. Koduri then went through each of his six pillars, explaining the role of that pillar in solving the compute challenge – and announcing several new Intel technologies along the way (more on those soon). Clearly, Intel’s strategy is to work to gain and maintain leadership positions in each of those six pillars, and to use that strength to make the world a better place. Oh, and also to continue to make enormous piles of cash. In short, Koduri said Intel wanted to ultimately provide every end user with access to 10 Peta FLOPS of compute power, accessing 10 Peta Bytes of data, all less than 10 milliseconds away. This appears to be Intel’s version of JFK’s 1961 “I believe that this nation should commit itself to achieving the goal, before this decade is out, of landing a man on the moon and returning him safely to the Earth.” – a simply stated but ambitious goal, a stake in the ground – designed to rally and inspire a sleeping giant into decisive action. Koduri didn’t add JFK’s “before this decade is out” which, for Intel, is probably a good thing. How did the assembled press corps respond to this sweeping and ambitious vision and challenge Intel laid out for themselves? There was really only one question. To paraphrase, “What went wrong and how are you going to fix it?” Why is this the question? Over the five-decades of Moore’s Law, much of the industry – and the trade press along with it – has gotten lazy. When a genie comes along once every two years and bestows a magical doubling of everything good, it’s difficult for the engineering community to be inspired to come up with new ways to squeeze out a meager 5% or 10% improvement in anything, particularly when most of your energy is consumed just unwrapping the gifts that are falling from the sky. Industry press and analysts trained ourselves to play this game as well, normalizing the notion that the only relevant question is “How are you doing on the next process node?” The answer to that question came to be so important in terms of predicting the winners and losers and the overall rate of progress in technology that all other avenues of investigation and inquiry decayed and fell by the wayside. Want to know how Intel is doing? Find out if they are ahead or behind in shipping the next node. Everything else is noise. Now that Intel is infamously late delivering “10nm”, there can be only one answer to the question of how Intel is doing. Thus, the press is reduced to asking, “What went wrong?” Let’s ignore Intel’s steady stream of record revenue quarters. We can also glaze over the fact that the company has a dominant presence in technology for the data center, that they absolutely own the architecture for every part of the compute infrastructure except the edge device itself, and that they have groundbreaking developments in compute architecture, memory, storage, networking, the software infrastructure that stitches all those together, and practically across all six of the pillars Intel is using to define the compute technology space. If the company has missed a Moore’s Law milestone, the press reasons, they have failed. No other information is important. And, perhaps that’s the reason Intel invited us up that hill in the first place and served us fish and wine in the former home of the father of Silicon Valley – to attempt to broaden our vision beyond the single-digit scoreboard of the tick-tock-tock of Moore’s Law, to get the analysts and writers assembled to consider the possibility that Intel is not quite dead yet, and to think about the emerging era of globally distributed heterogeneous computing with a renewed breadth and sophistication that transcends the limitations of lithography. Wait, when did you say 7nm will be shipping? Earlier this year, Intel hired former AMD Zen designer Jim Keller away from Tesla and made him senior VP in charge of silicon engineering. Keller took the floor after Koduri and exuded charm as his talk took a wild-ride-ramble through the convergence of his career and Intel’s need to convince analysts, and therefore investors, that Intel was bringing in the big guns, correcting course on this process node thing, and that the ship would be back on track any time now. See? It’s turning already. From the beginning, Moore’s Law was a race. In his landmark 1965 article that later became the defining document of “Moore’s Law,” Intel co-founder Gordon Moore made a remarkable number of incredibly insightful predictions. The majority of them later came true. Interestingly, the one that came to be known as “Moore’s Law” was not one of those. Moore’s Law has come to be understood as “a doubling of the number of transistors on a high-density chip every two years.” However, Moore’s original article actually said things would progress twice that fast: “The complexity for minimum component costs has increased at a rate of roughly a factor of two per year… Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least ten years.” Then, in 1975, at the end of that ten years, in an IEEE Speech called “Progress in Digital Electronics” Moore said the rate would slow to a doubling every 2 years: “…the rate of increase of complexity can be expected to change slope in the next few years … The new slope might approximate a doubling every two years, rather than every year, by the end of the decade.” From that date on, the industry circled around that one metric. And there was never any doubt that someday our exponential freight train of semiconductor scaling would go slamming into the wall of physics, bringing the Moore’s Law race to a close. The problem is – when a race ends at a wall – the leader is the first one to slam into the concrete. The end of Moore’s Law has been a fuzzy wall for sure. Physics didn’t jump in all at once. Thermal limitations caused Dennard Scaling to break down over a decade ago, and the industry started a game of compromise, choosing from power, performance, and cost, depending on system requirements. Economics stepped in next, with skyrocketing costs for lithography advances such as multiple patterning and EUV making “leading edge” processes impractical for all but a very small subset of new chip designs. Marketers muddied the waters by changing their logic in node naming, associating the “nm” numbers with a relative figure-of-merit that took into consideration power, performance, and cost improvements – independent of actual feature size. One company even claimed a new node with a process that used exactly the same feature size as the previous generation, but took advantage of FinFET transistor technology to deliver power and performance advantages. Intel themselves set about explaining to the world that their “10nm” generation was actually comparable to other companies’ “7nm” generation, implying that they were still actually delivering ahead, regardless of what the node names said. All of this fog brought us to the place we are today, with Intel delivering 10nm – and a host of new innovative technologies that were tied to that train – significantly later than promised or expected. That has placed them in the position of trying to distract the world from the question of “what went wrong?” with a credible, fascinating, and insightful narrative about the future of computing and Intel’s role in it. The truth is, there is much, much more to our technological evolution than transistor density. In fact, the influence of transistor density has been waning for over a decade as other key architectural advances have joined onstage. Intel is right to point that out, and to share their vision of the future and to outline the numerous areas ripe for innovation – in addition to process technology. But, really, what went wrong? Intel probably took too big a bite out of the Moore’s Law apple – setting overly ambitious goals for 10nm and finding themselves in a position where they struggled to meet the yield required to ship in volume. They doubled down on that error by having too many other product and technology releases tied to delivery of that 10nm process. While these problems have caused consternation for Intel, their shareholders, and their customers, they do not appear to have had significant impact on the company’s financial performance or their pace of innovation. During the course of “Architecture Day,” Intel announced a number of new technologies that we’ll be discussing in the coming weeks. New “FOVEROS” face-face 3D packaging technology could represent a major step forward in system-in-package integration, and it could allow a completely different approach to development of ICs. New 112 Gbps transceivers bring unprecedented bandwidth to SerDes connections. New Gen 11 integrated graphics processors will bring TFLOPS performance to small form-factor devices. New “Sunny Cove” Xeon processors will improve latency, throughput, and security in the data center. New improvements in Optane memory will bring more data closer to the CPU for faster processing of bigger data sets like those used in AI and large databases. SSDs based on Intel’s Terabit QLC NAND will move more bulk data from hard disks to SSDs, allowing faster access to that data, and, when combined with Optane memory, will fill critical gaps in the memory storage hierarchy, On the software side, a new “oneAPI” approach to software development will simplify the programming of diverse computing engines across CPU, GPU, FPGA, AI, and other accelerators. Intel is also releasing the Deep Learning Reference Stack, which is an integrated, open-source stack release designed to ensure that AI developers have easy access to all of the features and functionality of the Intel compute platforms. All of this we’ll cover in detail in the near future. But until then? Yeah, 10nm is way late. Read More Intel's Grand Vision - EE Journal : https://ift.tt/2LqIXEt
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The Fantasy 32 analyzes the NFL from a fantasy perspective, with at least one mention of each of the league's 32 teams. Though efficiency will be discussed plenty, the column will lean heavily on usage data, as volume is king (by far) in fantasy football. Use these tidbits to make the best waiver-wire, trade and lineup decisions for the upcoming week and beyond. Be sure to check back each week of the season for a new version of the Fantasy 32. Note that data from Monday Night Football might not be immediately reflected in charts. The infirmaryGreen Bay Packers RB Aaron Jones went down with a knee injury Sunday and is questionable, at best, for Week 16. If he's sidelined, Jamaal Williams will return to feature-back duties. Granted, he was the only remaining tailback on the 53-man roster, but Williams racked up 97 yards and one touchdown on 16 touches against a tough Bears defense Sunday. Williams, who is available in over 87 percent of ESPN leagues, is a must-add on waivers and will be a quality RB2 play against the Jets if Jones is out. Los Angeles Chargers WR Keenan Allen injured his hip against Kansas City and is dicey for Week 16. With Allen sidelined, Mike Williams broke out for 95 yards and three touchdowns on eight touches against the Chiefs. He was targeted nine times, which was three fewer than Tyrell Williams, who grabbed six passes for 71 yards. If Allen is out against Baltimore, Tyrell Williams will have the best matchup (against Brandon Carr) after he replaced Allen in the slot in Week 15. Both he and Mike Williams would be worth WR3 consideration, though the latter will have his hands full with Jimmy Smith and Marlon Humphrey on the outside. Consider Travis Benjamin a deep-league flex flier. Miami Dolphins RB Frank Gore left Sunday's game with a foot injury. With Kenyan Drake also limited again (28 snaps, one carry, three targets), rookie Kalen Ballage (26 snaps) was forced into a large role. The fourth-round pick carried the ball 12 times for 123 yards, highlighted by a 75-yard touchdown during which he was not touched. Ballage was limited to a 2-yard loss on his only target. With Gore expected to miss the rest of the season, Drake, Ballage and Brandon Bolden will handle backfield duties. Drake would be your best RB2 bet, though we'll need to monitor his health to see if he'll be ticketed for more carries. Ballage figures to handle most of Gore's workload and is a risky flex in deeper leagues. Houston Texans RB Lamar Miller hurt his ankle against the Jets, and though coach Bill O'Brien said it doesn't appear to be major, we'll need to monitor his status this week. In Miller's stead, Alfred Blue (40 snaps) plodded to nine carries for 6 yards, adding two catches for 9 yards. If Miller misses Sunday's game against the Eagles, Blue should be viewed as a candidate for 12-plus touches and would be a flex option. Keep in mind, D'Onta Foreman could also be activated for the first time, though he'd be too risky to start. Cincinnati Bengals WR Tyler Boyd suffered a knee injury during Sunday's victory over Oakland. Boyd said he expects to play in Week 16, but recent reports suggest he could miss time. John Ross (32 routes Sunday), Cody Core (27), Alex Erickson (14) and Auden Tate (zero) are next up on the depth chart, but none are exciting fantasy options. Ross would be your best flex bet and Tate is worth a stash in dynasty leagues. Opportunity alertThroughout this piece, I'll be referencing "OFP" and "OTD." OFP stands for opportunity-adjusted fantasy points. Imagine a league in which players are created equal. OFP is a statistic that weighs every pass/carry/target and converts the data into one number that indicates a player's opportunity to score fantasy points, or his expected fantasy point total. For example, if a player has an OFP of 14.5, it means that a league-average player who saw the same workload in the same location on the field would have scored 14.5 fantasy points. OTD works the same way, except instead of fantasy points, it's touchdowns. Here is the Week 15 OFP leaderboard: *Complete positional leaderboards will be posted at ESPN+ this week. Indianapolis Colts RB Marlon Mack appears to be the real deal. Injuries have been a problem, but Mack was terrific after contact (2.2) as a rookie and has produced well again in his second season (4.8 yards per carry, 2.1 yards after contact). Mack handled 27 carries for 139 yards and two scores against Dallas on Sunday, adding one catch for 10 yards. He paced the team's backs in snaps (42), though he did defer a lot of passing-down work to rookie Nyheim Hines (24 snaps, six targets). Mack's limited receiving role caps his upside, but as the lead back in the high-scoring Colts offense, he's certainly a viable RB2. Tennessee Titans RB Derrick Henry followed his 238-yard, four-touchdown Week 14 effort with a 170-yard, two-score performance against the Giants in Week 15. Henry has now scored 11 touchdowns during his past eight games, though he's been limited to nine catches during the span. The key from Week 15 was Henry's workload (season-high 47 snaps), as he clearly separated himself from Dion Lewis (22). Henry won't see 33 carries most weeks, but 20 is certainly attainable. Coupled with goal-line work and the occasional target, Henry is an RB2 against Washington in Week 16. FORPFORP is the difference between a player's actual fantasy point total and his OFP (or expected fantasy point total). First, here are the players who have fallen short of their OFP by the largest margin during the past month and are thus candidates to see a rise in fantasy production, assuming they see a similar workload: The Los Angeles Rams have made the FORP section of this series several times this season, but always as an offense playing quite a bit over its head. They've crashed to earth in recent weeks, but overcorrected to the point that the recent production of QB Jared Goff and WR Josh Reynolds has been well below expectation. Assuming their usage stays the same (as expected), both are strong rebound candidates for the final two weeks of the regular season. New York Jets RB Elijah McGuire was on the field for 53 of the team's 72 offensive snaps and racked up 21 touches against the Texans on Saturday. It was the team's first game since placing Isaiah Crowell on injured reserve. McGuire was held to 71 scrimmage yards, but scored a touchdown in the game. He was well ahead of rookie Trenton Cannon, who played 23 snaps and registered 10 touches. McGuire is clearly the team's feature back and that puts him on the RB2 radar Sunday against the Packers. McGuire is available in nearly 70 percent of ESPN leagues. And these players have exceeded their OFP by the largest margin during the past month and are thus candidates to see a dip in fantasy production moving forward: Minnesota Vikings RB Dalvin Cook played 37 of the team's 63 snaps Sunday and racked up 19 carries and a pair of targets in Kevin Stefanski's first game as offensive coordinator. Granted, they led through most of the game, but the Vikings called run a season-high 39 times (or 62 percent of the time). The numbers won't usually be that high, but it's clear that coach Mike Zimmer is committed to running the ball. Cook should push for 20 touches most weeks and is a fringe RB1. Buffalo Bills WR Robert Foster has looked terrific as an undrafted free-agent find and certainly could have a future as an NFL starter. He's eclipsed 93 receiving yards during four of his past five games. The problem is that Foster is lacking enough volume to continue his current level of production in Buffalo's run-heavy offense. Foster has cleared five targets in a game once in his career and has been over four targets twice. Despite the recent success, Foster is no more than a boom-or-bust flex. Seattle Seahawks WR Tyler Lockett has failed to score in back-to-back games and has failed to clear two targets during two of his past three outings. Lockett has been living on the edge by scoring nine touchdowns on only 63 targets this season and regression to the mean might have finally caught up to him. Consider Lockett a touchdown-dependent flex option in what could be a high-scoring affair against Kansas City in Week 16. Snap attackKansas City Chiefs RB Damien Williams surprised with two touchdowns on 10 carries (for 49 yards) to go along with six catches for 74 yards on six targets against the Chargers last week. It was Williams' most impressive NFL showing and came at a great time with Spencer Ware sidelined. Williams played 39 snaps in the game, which was well ahead of rookie Darrel Williams (13) and old friend Charcandrick West (one). If Ware remains out, Damien Williams will be a top-20 fantasy play at running back against Seattle. Detroit Lions RB Zach Zenner paced the team's backfield with 26 snaps, 10 carries, 12 pass routes and four targets Sunday. Theo Riddick was next in line with eight carries, 10 routes and three targets on 24 snaps, which left LeGarrette Blount demoted to a minimal role on 10 snaps. If Kerryon Johnson remains out in Week 16, this is a situation to avoid. Riddick is the safest play in PPR formats. San Francisco 49ers RB Matt Breida returned from a one-game absence Sunday and quickly regained lead-back duties. Breida played 42 snaps, carried the ball 17 times for 50 yards and caught all five of his targets for 46 yards. Jeff Wilson Jr. played 11 snaps, produced 46 yards on seven carries and failed to catch his lone target. Breida is back in the RB2 discussion, but is safest as a flex against Chicago's stellar defense Sunday. Wilson is no more than a handcuff. Now two games into the post-Emmanuel Sanders era, the Denver Broncos' "starting" wide receiver usage has been as follows: DaeSean Hamilton (138 snaps, 92 routes, 21 targets), Tim Patrick (111 snaps, 78 routes and 18 targets) and Courtland Sutton (108 snaps, 79 routes and 11 targets). It's become clear that Hamilton's role as Sanders' slot replacement means he's now the top fantasy asset at the position. Consider him a WR3. Sutton remains a big-play threat, but his lack of volume limits him to boom-or-bust flex territory. Patrick is seeing enough work to keep him in the flex discussion. Pittsburgh Steelers WR Eli Rogers made his 2018 debut Sunday. Though he was fourth in line at receiver, the team went heavy on four-wide sets (39 percent of pass plays), which allowed him four targets on 19 routes. With James Washington, Ryan Switzer and Darrius Heyward-Bey also mixing in behind Antonio Brown and JuJu Smith-Schuster, Rogers is not a fantasy option. Burning questionShould I bench Jacksonville Jaguars RB Leonard Fournette this weekend? No. Fournette is coming off a pair of down games, but still registered enough volume against Washington to allow 64 yards from scrimmage. Fournette was limited in the second half, but still played a position-high 26 snaps, which was well ahead of T.J. Yeldon (17) and rookie David Williams (seven). Prior to his recent two-game slump, Fournette ripped off three consecutive top-seven fantasy weeks. Fournette remains the team's feature back and is set up with a nice matchup against a Dolphins defense that was fleeced by Dalvin Cook and Latavius Murray on Sunday. Fire him up as an RB2. Quick hittersTo say the Baltimore Ravens' offense has changed with QB Lamar Jackson under center would be a massive understatement. Baltimore called pass 65 percent of the time during Weeks 1-9 when Joe Flacco handled most of the dropbacks. Since Jackson took over in Week 11, the pass rate is a league-low 40 percent (an average NFL offense would've called pass 59 percent of the time in the same game script). Jackson has yet to attempt more than 25 passes in a game but hasn't fallen below 19 attempts during the five starts. He's yet to post a fantasy week better than ninth but hasn't finished one of his starts worse than 15th. Jackson is a fringe QB1 option at the Chargers on Saturday. Atlanta Falcons WR Calvin Ridley scored six touchdowns during his first four NFL games but has found pay dirt only twice during his past 10 outings. During that stretch, Ridley has failed to clear five catches and 47 yards in eight different games. At best, he's a very risky flex option. Oakland Raiders TE Darren Waller made his team debut Sunday and put up 65 yards in the game. Despite the impressive showing, Waller isn't the solution to your tight-end woes. The former Raven touched the ball only twice on nine snaps in the game. Teammate Jared Cook remains a solid TE1 play despite a 23-yard showing Sunday. New York Giants TE Evan Engram caught eight of 12 targets for 75 yards against Tennessee on Sunday. Engram hasn't found the end zone since October, but has cleared 65 receiving yards in three consecutive games. Odell Beckham Jr. has missed the past two games, but Engram's workload suggests he should still be able to provide TE1 numbers once the star receiver returns, especially considering the top-heavy nature of the tight end position. Tampa Bay Buccaneers RB Peyton Barber has scored exactly one touchdown during four of his past five games. He ranks seventh in the league with 85 carries during the span, but minimal receiving production (26 yards on nine targets) has him 16th among backs in fantasy points. Barber is handling a massive share of the carries in Tampa Bay, but he has produced only three top-20 fantasy weeks this season. Consider him a low-ceiling flex. Chicago Bears WR Anthony Miller has been targeted a grand total of three times during his past three games. The rookie's usage has inexplicably been reduced following a strong start to his career, and therefore he's not close to fantasy relevance right now. Keep him stashed in dynasty. Cleveland Browns RB Duke Johnson Jr. carried the ball four times Sunday, which marked his highest total since Week 5. He was targeted five times, which matched his total from the previous three games. Despite the increase in usage, Johnson can't be trusted as a flex with Nick Chubb handling a majority of the touches. New England Patriots WR Julian Edelman was targeted 11 times Sunday and has now reached double-digit targets in five of his past seven games. He's fallen short of seven targets once in 10 games this season. Tom Brady's favorite target has finished 17th or better among wide receivers in fantasy points during six of his past seven games and sits ninth in fantasy points since returning from suspension in Week 5. Edelman is a fringe WR1 option. The return of Philadelphia Eagles QB Nick Foles appears to be just what the doctor ordered for WR Alshon Jeffery. Jeffery paced the team with eight targets against the Rams on Sunday. He caught all eight for 160 yards, the latter of which beats his previous season high by 55 yards. Jeffery has now put together back-to-back strong fantasy performances and makes for a WR2 play against Houston in Week 16. Washington Redskins TE Jeremy Sprinkle led Washington's tight ends in snaps (40) on Sunday -- the team's first outing without Jordan Reed this season. Vernon Davis was limited to 23 snaps, but matched Sprinkle in routes (12) and targets (three). Rookie Matt Flanagan (22 snaps, no targets) was also plenty involved. None of these players can be trusted in fantasy, but Davis remains the best option for those digging desperately for a tight end. Read More Fantasy football intel for all 32 teams ahead of Week 16 - ESPN : https://ift.tt/2Lo14uSIntel prepares to expand manufacturing in Israel as part of global plan - The Times of Israel12/18/2018 ![]() Intel Corp. is preparing plans to expand its manufacturing facilities in Israel, Ireland and the US state of Oregon, a senior official at the US technology giant said in an editorial posted on the website of the firm. “With the biggest market opportunity in Intel’s history ahead of us, we will take the necessary steps to prepare our global manufacturing network for flexibility and responsiveness to changes in demand,” Ann Kelleher, senior vice president and general manager of Manufacturing and Operations at Intel, wrote. “We are now in the early planning phase for manufacturing site expansions in Oregon, Ireland and Israel, with multi-year construction activities expected to begin in 2019.” The US firm is transitioning from being a maker of silicon computer chips to a data-centric company, with activities ranging from the manufacturing of chips to developing safety features in vehicles, wireless phone connections, drones and cloud-based technologies. Get The Start-Up Israel's Daily Start-Up by email and never miss our top stories Free Sign Up “Intel’s ability to optimize and apply our manufacturing expertise to deliver more advanced, differentiated products is foundational to our current and future success,” Kelleher wrote. Having additional factory space ready “will help us respond more quickly to upticks in the market and enables us to reduce our time to increased supply by up to roughly 60 percent,” she wrote. In the weeks and months ahead, Intel will be holding discussions with the aim of getting the necessary permits, with local governments and communities, she said. The expansion of sites and the related investments “will be taken in stages,” she wrote, and will be subject to change based on business, economic and other considerations, she said. In May, Intel confirmed plans to invest $5 billion (NIS 19 billion) in expanding its Kiryat Gat production plant in Israel, where it produces and develops some of its most advanced computer chips, through 2020. As part of the investment plan, Intel is expected to get a 5 percent tax rebate until the end of 2027, as well as a NIS 700 million government grant. Since setting up operations in Israel in 1974, the US firm has made cumulative investments and acquisitions of some $35 billion in Israel, as of May 2018, and has grown into the largest private sector employer in the high-tech industry, employing 11,000 workers. The firm last year acquired automotive technology firm Mobileye for a whopping $15.3 billion. There are some 1,000 additional workers employed in Mobileye. Intel has a manufacturing plant in Kiryat Gat, and R&D centers in Jerusalem, Petah Tikva and Haifa. Read More Intel prepares to expand manufacturing in Israel as part of global plan - The Times of Israel : https://ift.tt/2SeZBcM
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![]() Last year at Computex, Intel debuted an overclocked 5GHz 28-core Xeon CPU. It was always obvious that the CPU was more of a demonstration model than an actual shipping product — the 1.2kW cooler that Intel had to use to hit those kinds of clock speeds was a sign that 5GHz was a bit out of the conventional operating frequency range for this CPU. Nonetheless, Santa Clara did state that the chip would come to market as the Xeon W-3175X. Now, thanks to leaks from multiple European retailers, we know what price Intel is targeting. According to Hot Hardware, multiple European retailers are listing the CPU for between €4,045 and €4,525. It’s not clear how precisely this would map to US prices since it includes VAT, but it wouldn’t be unusual for Intel to simply swap the € and the $. The Xeon W-3175X uses the LGA3647 socket, with 12 DIMM slots and six memory channels (DDR4-2666 supported). Its base clock is 3.1GHz with a 4.3GHz boost clock and a 255W TDP (remember, all Intel TDPs are derived solely from base clock frequencies). This CPU does not use solder according to Tom’s Hardware, which will almost certainly impact overclocking efforts (and overclocking the chip could require two power supplies, not just one). The funny thing is that, by Intel standards, $4,000 – $5,000 for this CPU would be something of a steal. The 18-core Core i9-9980XE is a $1,979 CPU with a max boost clock of 4.5GHz, and while charging 2x or more for a 1.55x increase in core count isn’t exactly appealing, it’s not a terrible premium relative to the way this kind of feature is typically priced. The enterprise-oriented Xeon Scalable Platinum 8180 features the same silicon as the Xeon W-3175X but has a $10,000 price tag and a 2.5GHz/3.8GHz frequency spread. Of course, all of this is by Intel’s standards — AMD’s Threadripper offers an objectively better price/performance ratio in many instances compared with Intel’s Core X/Xeon W lines, though this has had remarkably little impact on Intel’s per-core pricing Intel isn’t even pretending that this CPU is aimed at gamers; the Xeon W-3175X is a content creation chip, through and through. That said, even for content creators, this is going to be a lot of CPU, particularly when its power requirements are taken into account. The 3175X is, in a sense, the swan song for monolithic die manufacturing as a whole. With both Intel and AMD moving to chiplet-style designs (Intel’s Cascade Lake AP will offer up to 48 cores, Epyc 2 will pack up to 64), the era of using monolithic chips at the highest core counts is coming to an end. That’s not to say that AMD and Intel will simply convert to chiplets across the board immediately — we expect both companies to optimize their dies and manufacturing approaches where it makes sense to do so and it may be that they pursue different strategies to some extent — but the era of monolithic dies dominating this space will be over in a year. Now Read: Read More Prices Leak for Intel's Monster 28-Core Xeon W-3175X CPU - ExtremeTech : https://ift.tt/2BvOfua![]() ![]() “We see great opportunity for McAfee to continue to advance and innovate” Private equity house Thoma Bravo is reported to be in talks with McAfee owners Intel and TPG Capital to buy the cybersecurity firm. The firm, which manages some £30 billion, already has a minority interest in McAfee. Intel bought California-based McAfee in 2011 for $7.7 billion. It completed the sale of a 51 percent stake in the company to TPG for $4.2 billion last year. (Thoma Brava has a minority share in the company through an April 2017 agreement with TPG.) Sources told Reuters that the talks were in their early stages.
It has already completed more than 30 total acquisitions of enterprise security companies to date and is aggressively pursuing further deals. Its latest was an agreement, last month, to buy application security testing firm Veracode from Broadcom for $950 million in cash. Further investments include SailPoint, Barracuda Networks, LogRhythm, Bomgar, BlueCoat Systems, SonicWall and Entrust. The firm was last month reported to have also approached Symantec with a takeover offer. McAfee, which holds some 1,200 security technology patents, employs over 7,200 globally, with a UK team approximately 300-strong. Its software is installed on 561 million total endpoints, including 87 percent of the world’s largest banks, and in the UK works closely with clients including the Ministry of Defence. It has had a complex recent history: Intel bought the firewall specialist 2010 for a striking $7.68 billion and rebranded it Intel Security. (The name McAfee became more closely associated with the company’s founder, John McAfee, who retired to Belize only to be accused of his neighbor’s murder and who is now running for President and promoting cryptocurrencies.) In 2017 Intel spun it off again to pursue “pure-play” cybersecurity. Thoma Brava commented at the time, taking its minority interest:”“McAfee is a global organization with a 30-year history and a brand known the world over for innovation, trust and collaboration. Given our years of focus on the security software sector, we see great opportunity for McAfee to continue to advance and innovate.” Seth Boro, a Managing Partner at the firm, added: “Our deep sector knowledge and history of helping build successful businesses will be an asset to the company, and we look forward to working with the management team and our colleagues at TPG and Intel to guide McAfee through its next chapter of growth.” See also: Intel Unveils New ArchitecturesRead More Intel to Sell McAfee: Reports - Computer Business Review : https://ift.tt/2SeRzRaIntel Announces Multi-Year Mission To Boost Chip Capacity Push To 7nm And Beyond - Hot Hardware12/17/2018 ![]() Today, things are definitely coming into "focus" as Intel senior vice president and general manager of Manufacturing and Operations Dr. Ann B. Kelleher says that the company is kicking off an extensive expansion campaign across the globe. The first priority for Intel at this time is boosting capacity for its 14nm product line, which brings us to Fab 42. Construction on Fab 42 initially began in 2011 in Chandler, Arizona. It was mostly finished by 2014, but Intel put the brakes on bringing the facility online as PC sales began to nosedive. However, the company announced early last year that it was investing $7 billion into completing construction and Kelleher announced today that Intel has "made good progress on the previously announced schedule for Fab 42 fit-out in Arizona." ![]() Once fully operational, Fab 42 will be capable of producing 22nm, 14nm and future 7nm products. In addition, Intel will use its New Mexico facilities to develop its next-generation storage and memory technologies, and that it is in the initial planning stages of fab expansions in Oregon, Ireland, and Israel. Construction on these fab expansions will begin in 2019, and likely won't be complete until early in the next decade. While Intel relies heavily on its own extensive fab operations, the company is not averse to relying on outside foundries given the right conditions. "We will continue our selective use of foundries for certain technologies where it makes sense for the business," Kelleher added. "As we invent more products for a broader set of customers, you can expect us to be strategic about the application of Intel’s differentiated manufacturing capability and the selective use of foundries." ![]() Looking forward, Intel is hoping that these updates to its fab and added capacity will help fend off shortages in the future and help it to fully address the [estimated] $300 billion market for silicon. After all, Intel has diversified itself over the years from a mostly PC-centric company to one that dominates the server market (96+ percent market share) and even produces cellular modems that go into popular products like Apple's iPhones. When you couple that with the company's SSD/3D XPoint products and even upcoming discrete GPUs, it's easy to see why Intel wants to be sure that "the beast" is fed without any interruptions. Read More Intel Announces Multi-Year Mission To Boost Chip Capacity, Push To 7nm And Beyond - Hot Hardware : https://ift.tt/2A39kff |
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January 2020
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